G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling StdPbc-0615 This specification is limited to

This specification is limited to the measurement of focus and depth of focus for photolithography as used in the manufacture of integrated circuits and closely allied technologies

5 × 1015 cm 3 at cryogenic temperatures (below 80 K)

Developed with SEMI’s strategic partner Beebolt

本安全ガイドラインは，以下の内容が記載されている：

this Guide describes setting targets for

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling StdPbc-0615 This specification is limited toThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.