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SEMI E62-0298 (technical revision)
This Specification defines wafer transport planes within cassette and process modules
1-0703 (Reapproved 0623) — Specification for SECS-II Protocol for Handler Specific Equipment Model (HSEM)
この方法において定義されるチューブフィッティングのうち内部の液体と接触する全ての部分は，フロロカーボン材質でできている。
SEMI E148-0309 (technical revision)
M07800 - SEMI M78 - 量産時における130nmから22nm世代のパターンなしシリコンウェーハ上のナノトポグラフィー決定に関するガイド Revision:SEMI M78-1110 - Superseded SEMI E62-0298 (technical revision)global Silicon Wafer Committee2010827global Audits and Reviews Subcommittee201010www. semi. org 2003(CMP)CMP ( 1) Referenced SEMI Standards SEMI M1 Specifications for Polished Single Crystal Silicon Wafers SEMI M20 Practice for Establishing a Wafer Coordinate System SEMI M43 Guide for Reporting Wafer Nanotopography SEMI M49 Guide for Specifying Geometry Measurement Equipment for Silicon Wafers for the 130 nm to 22 nm Technology Generations SEMI M59
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