G08200 - SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process Revision:SEMI G82-0301E (Reapproved 0706) - Superseded SEMI M21-0318 (technical revision)

SEMI M21-0318 (technical revision)

FPD製造装置で0

ultrasonic scan mapping

Bonding wire

This Test Method is used to measure die strength for dies from processed wafers

G08200 - SEMI G82 - Specification for 300 mm Load Port for Frame Cassettes in Backend Process Revision:SEMI G82-0301E (Reapproved 0706) - Superseded SEMI M21-0318 (technical revision)This Specification defines dimensional requirements for the load port of frame cassette for 300 mm wafer in backend process equipment. It is intended to promote a uniform physical interface between equipment and the factory, to facilitate the use of automated frame cassette transport systems, and or to meet ergonomic requirements for manually loaded equipment. This is a Standard covering equipment for 300 mm frame cassette only. Referenced SEMI