P02900 - SEMI P29 - Specification for Characteristics Specific to Attenuated Phase Shift Masks and Masks Blanks Revision:SEMI P29-0997 - Superseded equipment for applying and reading

equipment for applying and reading marks is easily available

and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer’s cleanroom manufacturing area

Dimensional measurements made with an optical microscope are made on the optical image of the specimen and not directly on the specimen itself

B：形状測定を使用した段差法

1-0703 (technical revision)

P02900 - SEMI P29 - Specification for Characteristics Specific to Attenuated Phase Shift Masks and Masks Blanks Revision:SEMI P29-0997 - Superseded equipment for applying and readingThis Specification covers the characteristics specific to attenuated phase shift masks and mask blanks. Referenced SEMI Standards SEMI P1 Specification for Hard Surface Photomask Substrates SEMI P2 Specification for Chrome Thin Films for Hard Surface Photomasks SEMI P22 Guideline for Photomask Defect Classification and Size Definition SEMI P28 Specification for Overlay Metrology Test Patterns for Integrated Circuit Manufacture