F11500 - SEMI F115 - Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components StdTpc-Terminology single crystal polished silicon wafers

single crystal polished silicon wafers used in semiconductor device and integrated circuit manufacturing

the equipment is in the scope regardless of the type of process or type of equipment

SEMI G43 — Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages

there could be other applicable chemicals

本測定方法は，

F11500 - SEMI F115 - Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components StdTpc-Terminology single crystal polished silicon wafersThis Document defines a test method for determining metallic elements present on the wetted surfaces of ultra high purity (UHP) chemical delivery systems and components. This Test Method is applicable to UHP chemical delivery systems and components. Examples of test samples include valves, regulators, filters, mass flow controllers, tubing, weld fittings, and face seal fittings. This Test Method could also be used to determine the contamination