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SEMI 3D5-0613 (first published)
This Test Method provides the procedure to determine whether a specific particle deposition system
Failure mechanisms
The test is intended to accelerate the corrosion while simulating conditions that may be found within process equipment and gas systems in the semiconductor industry
This activity shall develop a new specification of indoor lighting simulator requirements for performance measurement of emerging PV and device qualification
MF145100 - SEMI MF1451 - Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning Revision:SEMI MF1451-0707 (Reapproved 0421) - Current SEMI 3D5-0613 (first published)Sori can significantly affect the yield of semiconductor device processing. Knowledge of this characteristic can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. Changes in wafer sori during processing can adversely affect subsequent handling and processing steps. These changes can also provide an important process monitoring function. This Test Method is suitable
